11.8mm x 12mm x 1.6mm
Categories: (Modules, Wi-Fi, HP SDIO) (Modules, Multi Radio, HP SDIO)

BALI SDIO

High performance multi-radio module supporting 802.11 a/b/g/n/ac WiFi + Bluetooth 5.0

  • Supports SDIO host interface with high data throughputs
  • FCC, IC, CE certified
  • Enterprise level security
  • Highly integrated module with tuned RF for high performance and long range
  • Advanced WLAN and Bluetooth coexistence for superior throughput and low-latency

BALI SDIO is a high performance multi-protocol certified wireless module supporting dual-band 1-stream (1T1R) 802.11 a/b/g/n/ac Wi-Fi and BT5.0. This small form-factor Wi-Fi and Bluetooth combo module provides superior throughputs and long range by integrating high performance baseband, MAC, fine-tuned RF front end, power amplifiers, filters, switches, diplexer and crystals. With advanced coexistence algorithms, this module delivers low-latency and excellent rate-over-range performance for superior user experience. Enables secure connections using strong encryption and enterprise security protocols. These WiFi modules with Bluetooth enables low-power designs by utilizing multiple advanced power-saving techniques and many host off-loading features. This SDIO Wi-Fi module with BT is based on Qualcomm QCA9377 SoC and connects to host processor with SDIO 3.0 (Wi-Fi) and UART (BT).

This multi-radio module comes with drivers for different operating systems (Linux and Android) for complete design flexibility and ease of integration. It is offered in commercial and industrial temperature grades.

Applications

  • Industrial IoT
  • Security cameras
  • Automotive in-vehicle Infotainment
  • PoS terminals
  • Printers

WiFi features

  • Industry proven best performing Wi-Fi Technology supporting low power dual-band (2.4 and 5 GHz), 1-stream MU-MIMO 802.11ac
  • Offers advanced security features: WPA/WPA2 Personal and Enterprise, WPS 2.0
  • WLAN Encryption : WEP, TKIP, AES
  • Operating modes :
    • STA and SoftAP
    • P2P Group Owner, P2P Client
    • STA + SoftAP, STA + P2P Group Owner, STA + P2P Client, Support for multiple BSSID (Two softAPs and a STA can operate concurrently)
  • Host Power save : Address Resolution Protocol (ARP) offloading, Wake-on-Wireless
  • Transmit beamforming
  • WMM, DFS (Master, Client)
  • Module Power save : Deep sleep mode, protocol power save modes – Legacy, UAPSD and Tx power saving feature : GreenTx
  • Roaming : 11r/FT, Legacy fast roaming
  • 802. 11ai : FILS-SK in STA mode

Bluetooth features

  • Bluetooth technology : Bluetooth 5.0 + HS and Bluetooth Low Energy
  • Bluetooth class : Supports Bluetooth for Class-1 and Class-2 transmissions without requiring an external power amplifier
  • Bluetooth stack : Fluoride, BlueZ
  • BT 5.0 core profiles : SDP, L2CAP, GAP
  • BT 5.0 application profiles : All BT SIG (BR/EDR and BLE) profiles including HFP 1.6, A2DP/BT Audio
  • BLE concurrent roles : BLE concurrent central and peripheral

Common features

  • Host interfaces : SDIO 3.0 for WiFi and UART for Bluetooth
  • WLAN + Bluetooth coexistence
  • Globally certified module
  • Package: 11.8mm x 12mm x 1.6mm LGA
  • Industrial temperature grade
WLAN Technology 802.11 abgn, 1-stream MU-MIMO 802.11ac
BT Technology Bluetooth v5.0 + HS
Frequency band 2.4GHz, 5GHz
On air data rates 2.4GHz

  • 11b – 1, 2, 5.5, 11Mbps
  • 11g – 6, 9, 12, 18, 24, 36, 48, 54Mbps
  • 11n – MCS0 to MCS7 or up-to 150Mbps

5GHz

  • 11a – 6, 9, 12, 18, 24, 36, 48, 54Mbps
  • 11n/ac – MCS0 to MCS9 or Up to 433Mbps
Security features WPA/WPA2 -PSK TKIP/AES, WPS 2.0, Enterprise Security (EAP) STA only
Modulation schemes 2.4GHz

  • 11b – BPSK, QPSK, CCK
  • 11g – BPSK, QPSK, 16QAM, 64 QAM
  • 11n – PSK, QPSK, 16QAM, 64 QAM

5GHz

  • 11n/ac – BPSK, QPSK, 16QAM, 64 QAM
Antenna options Antenna pin
SDIO host interface WiFi – SDIO 3.0 / SDR104
Bluetooth – UART/PCM
Max throughput 330 Mbps
Maximum Transmit Power
  • WiFi: 20dBm
  • BT: 15dBm
  • BLE: 4dBm
Receive Sensitivity
  • WiFi:  -97.5dBm
  • BT:     -96dBm
  • BLE:    -99dBm
WLAN bandwidths 20/40/80MHz
Power supply 3.3V (core) and 1.8V/3.3V (I/O)
Operating Temperature -40C to 85C
Humidity 5-90% non-condensing
Package 11.8mm x 12mm x 1.6mm  LGA
Certifications and approvals FCC, IC, CE
BT SIG certification
Product Brief
190 KB
Quick Start Guide
185 KB
EVK User Guide
3 MB
Data Sheet
2 MB
  • BALI SDIO DVK
  • BALI SDIO microSD EVK
  • 1 x u.FL Flex antenna
  • 1 x Micro USB cable
  • 2 x legs for SDIO EVK
  • Ixora board
  • Apalis imx6 SoM
  • Ixora Power adapter
  • IDC-DB9 male adapter
  • USB serial converter

-Fill the form and submit or drop an email at sales@ivativ.com

Part No Protocol Architecture Dimensions
(L x W x H) in mm		 Package Antenna Description
I950HCR0-I0LT 802.11 ac/a/b/g/n + Bluetooth 5 Hosted 11.8 x 12 x 1.6 LGA Pin BALI SDIO module with Antenna Pin, Tray packing Buy
I950HCR0-I0LR 802.11 ac/a/b/g/n + Bluetooth 5 Hosted 11.8 x 12 x 1.6 LGA Pin BALI SDIO module with Antenna Pin, Tape and Reel packing Buy

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