Categories: (Modules, Wi-Fi, HP SDIO)


High performance Wi-Fi module supporting 802.11 a/b/g/n/ac MU-MIMO

  • Supports SDIO host interface with high data throughputs
  • FCC, IC, CE certified
  • Enterprise level security 802.1x and advanced encryption protocols WPA/WPA2
  • Highly integrated module with tuned RF for high performance and long range

EVIA M.2 SDIO is a high performance certified wireless module supporting dual-band 1-stream (1T1R) 802.11 a/b/g/n/ac Wi-Fi. This M.2 1216 standard form-factor Wi-Fi module provides superior throughputs and long range by integrating high performance baseband, MAC, fine-tuned RF front end, power amplifiers, filters, switches, diplexer and crystals. Enables secure connections using strong encryption and enterprise security protocols. This dual band WLAN SDIO module enables low-power designs by utilizing multiple advanced power-saving techniques and many host off-loading features. This M.2 Wi-Fi module is based on Qualcomm QCA9377 SoC and connects to host processor with SDIO 3.0 (Wi-Fi) interface.

It comes with drivers for different operating systems (Linux and Android) for complete design flexibility and ease of integration. It is offered in commercial and industrial temperature grades.


  • Industrial applications
  • Smart appliances
  • Security cameras
  • Infotainment for automotive
  • PoS
  • Printers
  • IP phone

WiFi features

  • Industry proven best performing Wi-Fi Technology supporting low power dual-band (2.4 and 5 GHz), 1-stream MU-MIMO 802.11ac
  • Offers advanced security features: WPA/WPA2 Personal and Enterprise, WPS 2.0
  • WLAN Encryption : WEP, TKIP, AES
  • Operating modes :
    • STA and SoftAP
    • P2P Group Owner, P2P Client
    • STA + SoftAP, STA + P2P Group Owner, STA + P2P Client, Support for multiple BSSID (Two softAPs and a STA can operate concurrently)
  • Module Power save : Deep sleep mode, protocol power save modes – Legacy, UAPSD and Tx power saving feature : GreenTx
  • Host Power save : Wake-on-Wireless, ARP offloading to firmware
  • Transmit beamforming
  • QoS/WMM and WMM-PS
  • DFS Client and Master
  • Roaming : 11r/FT, Legacy fast roaming
  • 802.11ai : FILS-SK in STA mode
  • Host interfaces : SDIO 3.0 for WiFi
  • Globally certified module
  • Package: 1216 M.2 LGA
  • Industrial temperature grade
WLAN Technology 802.11 abgn, 1-stream MU-MIMO 802.11ac
Frequency band 2.4GHz, 5GHz
On air data rates 2.4GHz

  • 11b – 1, 2, 5.5, 11Mbps
  • 11g – 6, 9, 12, 18, 24, 36, 48, 54Mbps
  • 11n – MCS0 to MCS7 or Up to 150Mbps


  • 11a – 6, 9, 12, 18, 24, 36, 48, 54Mbps
  • 11n/ac – MCS0 to MCS9 or Up to 433Mbps
Security features WPA/WPA2 -PSK TKIP/AES, WPS 2.0, Enterprise Security (EAP) STA only
Modulation schemes 2.4GHz

  • 11b – BPSK, QPSK, CCK
  • 11g – BPSK, QPSK, 16QAM, 64 QAM
  • 11n – PSK, QPSK, 16QAM, 64 QAM


  • 11n/ac – BPSK, QPSK, 16QAM, 64 QAM
Antenna options Antenna Diversity with 2 x MHF4
Host interface Wi-Fi – SDIO 3.0
Max throughput 330 Mbps
Maximum Transmit Power 20dBm
Receive Sensitivity -97.5dBm
WLAN bandwidths 20/40/80MHz
Power supply 3.3v
Operating Temperature -40C to 85C
Humidity 5-90% non condensing
Package 12mm x 16mm x 1.9mm M.2 LGA
Certifications and approvals FCC, IC, CE
Product Brief
201 KB
Quick Start Guide
185 KB
EVK User Guide
3 MB
Data Sheet
3 MB
  • EVIA M.2  SDIO microSD EVK
  • 1 x MHF4 Flex antenna
  • 2 x legs for EVK
  • Ixora board
  • Apalis imx6 SoM
  • Ixora Power adapter
  • IDC-DB9 male adapter
  • USB serial converter

Fill the form and submit or drop an email to

Part No Protocol Architecture Dimensions
(L x W x H) in mm
Package Antenna Description
I950HC00-I61T 802.11 ac/a/b/g/n Hosted 12 x 16 x 1.9 M.2 LGA MHF4 EVIA M.2 SDIO module with Antenna Diversity, Tray packing Buy
I950HC00-I61R 802.11 ac/a/b/g/n Hosted 12 x 16 x 1.9 M.2 LGA MHF4 EVIA M.2 SDIO module with Antenna Diversity, Tape and Reel packing Buy

Product Enquiry